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Flip- chip COB(Full flip COB 1R1G1B) 600*337.5mm

Cabinet size: 600×337.5×39.5mm

Module size: 150×168.75mm

Weight:4kg

Pixel pitch(mm): P0.78/P0.9375/P1.25/P1.5625 /P1.875

Pixel Structure: Full Flip COB 1R1G1B

White balance brightness:800-1200 nits

Input:AC100-240V 50/60HZ

Maintenance Method: Front maintenance

Material: Die-cast aluminum

Usage: Indoor

    Core Technical Features of COB Cabinets

    Full Flip-Chip COB Packaging Technology 

       - Technical Advantages: Utilizes flip-chip bonding to directly mount LEDs onto the PCB, eliminating traditional SMD brackets and reflow soldering processes, thereby enhancing reliability. Flip-chip COB offers superior heat dissipation.  
       - Protection Performance: Full encapsulation achieves IP65 rating, ensuring dustproof, waterproof, impact-resistant, and anti-static properties. Suitable for harsh environments with high humidity, dust, etc.  
       - Visual Optimization: Matte surface treatment reduces glare, while black light-absorbing materials enhance contrast ratio (≥15,000:1), minimize visual fatigue, and ensure optimal performance for close-range viewing. 

      Flip-chip-cob8

      Energy Efficiency and Thermal Design

       - Power Optimization: Common cathode driving technology reduces energy consumption, with average power 168W/m² and peak power 500W/m². Screen temperature is 30% lower than traditional LEDs.  

       - Passive Cooling Structure: Fanless die-cast aluminum alloy cabinet leverages metal conductivity for efficient heat dissipation, avoiding dust ingress from ventilation holes.  

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        Cabinet Structure and Specifications 

        1. Mainstream Cabinet Specifications: Front-maintainable design, pixel pitch as low as P0.6, 16:9 aspect ratio, flatness ≤0.07mm, and XYZ-axis six-directional adjustment for seamless splicing.  

        2. Power and Signal Redundancy 
           - Dual power backup and dual receiver cards with mutual redundancy ensure uninterrupted operation during component failure, enhancing system stability.  

        3. Maintenance Methods 
           - Full Front Maintenance: Modules, power supplies, and receiver cards can be hot-swapped and disassembled from the front without removing the cabinet, improving maintenance efficiency.  
           - Flexible Compatibility: Some models support both front and rear maintenance for diverse installation scenarios.  

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